DESCRIZIONE

General information
Type CPU / Microprocessor
Market segment Desktop
Family
Intel Core i7
Model number ?
i7-7740X
CPU part numbers

CM8067702868631 is an OEM/tray microprocessor
BX80677I77740X is a boxed processor (English version)
BXC80677I77740X is a boxed processor (Chinese version)

Frequency ? 4300 MHz
Turbo frequency 4500 MHz
Bus speed ? 8 GT/s DMI
Clock multiplier ? 43
Package 2066-land Flip-Chip Land Grid Array
Socket Socket 2066 / R4 / LGA2066
Introduction date May 30, 2017 (announcement)
June 2017 (availability)
S-spec numbers
Part number Production processors
SR3FP
BX80677I77740X +
BXC80677I77740X +
CM8067702868631 +
Architecture / Microarchitecture
Microarchitecture Kaby Lake
Processor core ? Kaby Lake-X
Core stepping ? B0 (SR3FP)
Manufacturing process 0.014 micron
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size ? 4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size ? 4 x 256 KB caches
Level 3 cache size 8 MB shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Features

MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / Intel 64 ?
NX / XD / Execute disable bit ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
TBT 2.0 / Turbo Boost technology 2.0 ?

Low power features Enhanced SpeedStep technology ?
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR4-2666
Maximum memory bandwidth (GB/s): 42.7
Other peripherals

Direct Media Interface 3.0
PCI Express 3.0 interface (16 lanes)

Electrical / Thermal parameters
Thermal Design Power ? 112 Watt