DESCRIZIONE

General information
Type CPU / Microprocessor
Market segment Desktop
Family
Intel Core i7
Model number ?
i7-5820K
CPU part numbers

CM8064801548435 is an OEM/tray microprocessor
BX80648I75820K is a boxed processor without fan and heatsink (English version)
BXC80648I75820K is a boxed processor without fan and heatsink (Chinese version)

Frequency ? 3300 MHz
Turbo frequency 3400 MHz (3 cores or more)
3600 MHz (1 or 2 cores)
Low power frequency 1200 MHz
Bus speed ? 5 GT/s DMI
Clock multiplier ? 35
Package 2011-land Flip-Chip Land Grid Array
Socket Socket 2011-3 / R3 / LGA2011-3
Size 2.07" x 1.77" / 5.25cm x 4.5cm
Introduction date August 29, 2014
S-spec numbers
Part number ES/QS processors Production processors
QFRC SR20S
BX80648I75820K +
BXC80648I75820K +
CM8064801548435 +
Unknown +
Architecture / Microarchitecture
Microarchitecture Haswell
Processor core ? Haswell-E
Core steppings ? M0 (QFRC)
R2 (SR20S)
CPUID 306F2 (QFRC)
Manufacturing process 0.022 micron
Data width 64 bit
The number of CPU cores 6
The number of threads 12
Floating Point Unit Integrated
Level 1 cache size ? 6 x 32 KB 8-way set associative instruction caches
6 x 32 KB 8-way set associative data caches
Level 2 cache size ? 6 x 256 KB 8-way set associative caches
Level 3 cache size 15 MB 20-way set associative shared cache
Physical memory 64 GB
Multiprocessing Uniprocessor
Features

MMX instructions
SSE / Streaming SIMD Extensions
SSE2 / Streaming SIMD Extensions 2
SSE3 / Streaming SIMD Extensions 3
SSSE3 / Supplemental Streaming SIMD Extensions 3
SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 ?
AES / Advanced Encryption Standard instructions
AVX / Advanced Vector Extensions
AVX2 / Advanced Vector Extensions 2.0
BMI / BMI1 + BMI2 / Bit Manipulation instructions
F16C / 16-bit Floating-Point conversion instructions
FMA3 / 3-operand Fused Multiply-Add instructions
EM64T / Extended Memory 64 technology / Intel 64 ?
NX / XD / Execute disable bit ?
HT / Hyper-Threading technology ?
VT-x / Virtualization technology ?
VT-d / Virtualization for directed I/O
TBT 2.0 / Turbo Boost technology 2.0 ?

Low power features Enhanced SpeedStep technology ?
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 4
Supported memory: DDR4-1333, DDR4-1600, DDR4-2133
Maximum memory bandwidth (GB/s): 68
Other peripherals

Direct Media Interface 2.0
PCI Express 3.0 interface (28 lanes)

Electrical / Thermal parameters
Maximum operating temperature ? 66.8°C
Thermal Design Power ? 140 Watt